Solutions to Improve Diamond Blades in Semiconductor Manufacturing 

After mounting the blade upon the machine, it is tested for concentricity. Friction and heat may release strains in the core material during operation, allowing tension to relax. As a result, machine tensioning is a frequent procedure.

The diamond wheel head should be dynamically balanced, with clean, parallel, and smooth clamping surfaces. The diamond materials must be carefully chosen for their particle size, strength, and shape. Lastly, the diamond blade must be handled with delicacy. It must be installed, tensioned, polished, and operated appropriately.

All of these elements contribute to the ultimate outcome, which is the efficient and precise slicing of semiconductor wafers to precise tolerances with the least amount of kerf loss and product damage possible.